back to all posts

December 16, 2021

December 16, 2021

Seed IP Law Group welcomes Tyler J. Thorp, Ph.D. as Of Counsel

Seed IP Law Group’s Electrical Engineering & Computer Science Group proudly welcomes Tyler J. Thorp, Ph.D. as Of Counsel. Tyler’s practice focuses on patent matters pertaining to electrical, mechanical, and software technologies, including developing global patent portfolios and evaluating patent portfolios in support of litigation and licensing activities. He has a passion for deeply understanding his client’s technology and partnering with them to develop strong and enforceable patent portfolios that support their business objectives.

Tyler has a decade of prior engineering experience in hardware and software development. He is a named inventor on over 65 U.S. patents and was previously an Affiliate Assistant Professor in the Electrical Engineering Department at the University of Washington.

Tyler is admitted to the state bars of Washington and California, and is registered to practice before the United States Patent and Trademark Office. He is admitted to practice in the United States District Court for the Northern District of California, the United States Court of Appeals for the Ninth Circuit, and the United States Court of Appeals for the Federal Circuit.

 Learn more about Tyler Thorp

recent news
News & Events
Team News
https://assets-global.website-files.com/5f15f11facaf57517589d0e3/624e5b5d3403ae479bbfa0ba_Seed_IP_Media_Library_Generic4.png
Amy Strok

Seed IP Law Group participates in and sponsors Food Lifeline’s Food Frenzy – July 15-29

News & Events
Litigation News
https://assets-global.website-files.com/5f15f11facaf57517589d0e3/624e7b01feb3f0635501be56_Seed_IP_Media_Library_Generic12.png
Jeffrey E. Danley

Cal. Tech. v. Broadcom: The Federal Circuit Strengthens the IPR Estoppel Provision and Strikes Down a Multi-Tiered Royalty Rate Argument

News & Events
https://assets-global.website-files.com/5f15f11facaf57517589d0e3/62b389baefbc6b2a17563635_Seed_IP_Media_Library_Generic3.png
Toshiko Takenaka, Ph.D.

Seed IP sponsors 2022 Global Innovation Law Summit - July 22 and 29